首页> 外文OA文献 >Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds Efeito do envelhecimento térmico nas reações interfaciais de ligas de soldagem branda a base de estanho em substratos de cobre e cinética de formação e crescimento de compostos intermetálicos

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Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds Efeito do envelhecimento térmico nas reações interfaciais de ligas de soldagem branda a base de estanho em substratos de cobre e cinética de formação e crescimento de compostos intermetálicos

机译：热时效对锡基焊料合金与铜基体界面反应及金属间化合物形成和生长动力学的影响热时效对锡基软合金在铜基体上界面反应及形成动力学的影响金属间化合物的生长

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J. C. Madeni; S. Liu;
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年度 2011
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1. Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds [J] . Madeni J. C., Liu S. Sodagem & inspecao . 2011,第1期

机译：热时效对锡基钎料合金与铜基体界面反应及金属间化合物形成与生长动力学的影响
2. Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5ln solder and bare copper substrate [J] . D.-G. Kim, H.-S. Jang, S.-B. Jung Materials Science and Technology: MST: A publication of the Institute of Metals . 2005,第3期

机译：Sn-8Zn-5ln焊料与裸铜基体之间金属间化合物层生长和界面反应的动力学
3. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing [J] . Wang Jing, Chen Guang, Sun Fulong, Corrosion science . 2018,第JULa期

机译：由于等温老化，表面氧化和界面金属间化合物的生长对铜基板上电沉积锡薄膜可焊性降低的综合影响
4. Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-free Flip Chip Solder Bump during Solid State Isothermal Aging [C] . Dae-Gon Kim, Hyung-Sun Jang, Young-Jig Kim, International Symposium on Eco-Materials Processing amp; Design; 20050116-18; Jinju(KR) . 2005

机译：固态等温时效过程中无铅倒装锡焊块中金属间化合物的生长动力学和界面反应
5. The intermetallic formation and growth kinetics at the interface of near eutectic tin-silver-copper solder alloys and gold/nickel metallization. [D] . Gao, Mao. 2010

机译：在接近共晶的锡银铜焊料合金与金/镍金属化的界面处，金属间的形成和生长动力学。
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds Efeito do envelhecimento térmico nas reações interfaciais de ligas de soldagem branda a base de estanho em substratos de cobre e cinética de formação e crescimento de compostos intermetálicos [O] . J. C. Madeni, S. Liu 2011

机译：热老化对锡基焊料合金与铜基体界面反应及金属间化合物形成和生长动力学的影响热老化对温和锡基焊接合金在铜基体上的界面反应和形成动力学的影响和金属间化合物的生长
8. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging [R] . Minor, A. M. , Morris, J. W. 1999

机译：老化后在焊料 - 基板界面上生长au-Ni-sn金属间化合物

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